Industrial Customized Inspection System

Wafer Inspection System	Die Saw Inspection

Wafer dimensions Wafer defect	Die dimensions Die saw Die chip edges Die FM Die Ink / Test
Leadframe Inspection	Die Bonding Inspection Die Inspection Items

Leadframe dimensions Leadframe placement offset Leadframe defect	Die missing Die placement offset Die rotation offset Die defect Die wrong
Wire Bonding Inspection Wire Ball Inspecting Items	Wire Bonding Inspecting Items

Ball missing Ball placement Ball size Ball broken Ball defect	Wire broken Wire missing Wire unbonded Wire short Wire height Wire close gap Wire height Wire sway
Bumping Inspection Items	Probe Card Inspection System Probe Card PIN Inspecting and Adjustment Items

Bump ball missing Bump ball placement Bump ball size Bump ball broken	PIN missing PIN broken PIN placement PIN offset PIN size PIN height PIN level